RF, Microwave and Photonics Packaging (RaMPoP) Conference 2026
RF, Microwave and Photonics Packaging (RaMPoP) Conference 2026
The RF, Microwave and Photonics Packaging (RaMPoP) Conference, organised by IMAPS-UK, will take place on 26 November 2026 at the Compound Semiconductor Applications Catapult in Newport, South Wales.
Bringing together industry, academia, equipment and materials suppliers, and manufacturers, the conference will explore the advanced packaging technologies needed to turn RF, microwave and photonics innovations into reliable, manufacturable products.
The programme features presentations from Filtronic, Bay Photonics, Oxford Lasers, XTPL and Tektronix, alongside research contributions from the Universities of Birmingham, Southampton and Swansea.
Key themes include high-frequency devices, photonics and co-packaged optics, interconnect technologies, testing and measurement, and advanced manufacturing processes.
The event also includes an exhibition, networking opportunities and an optional tour of the Semiconductor Catapult.
A separate Microelectronics Packaging Workshop will take place on Wednesday 25 November, covering wafer preparation, die attachment, interconnection, encapsulation, and testing.
Further information, programme and registration: IMAPS-UK R
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