Microelectronics Packaging Workshop 2026

IMAPS-UK will host a Microelectronics Packaging Workshop on Wednesday 25 November 2026 at the Compound Semiconductor Applications Catapult in Newport, South Wales.

The workshop will provide an introduction to the processes, materials and technologies involved in microelectronics packaging, with a focus on ensuring the performance, reliability and manufacturability of electronic and semiconductor devices.

The programme will cover four key areas:

• Wafer preparation
• Die attachment and interconnection
• Encapsulation and packaging options
• Testing and inspection

Designed for engineers, technicians, researchers, students and industry professionals, the workshop offers an opportunity to develop practical knowledge of microelectronics assembly and packaging technologies.

The afternoon programme begins at 12:45, following a networking lunch at 12:00, and concludes at approximately 16:30.

The workshop precedes the RF, Microwave and Photonics Packaging (RaMPoP) Conference, taking place at the same venue on 26 November 2026.

Further information and registration: IMAPS-UK Microelectronics Packaging Workshop